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PD 6.118 IRPT1061A
PRELIMINARY
IRPT1061A
TM
Power Module for 1 hp Motor Drives
* 1 hp (0.75 kW) power output
Industrial rating at 150% overload for 1 minute
* * * * * * * * * *
180-240V AC input, 50/60 Hz 3-phase rectifier bridge 3-phase ultrafast IGBT inverter HEXFRED ultrafast soft recovery freewheeling diodes Brake IGBT and diode Low inductance (current sense) shunts in positive and negative DC rail NTC temperature sensor Pin-to-baseplate isolation 2500V rms Easy-to-mount two-screw package Case temperature range -25C to 125C operational
Figure 1. IRPT1061A Power Module
IRPT1061C
IRPT1061A Power Module IRPT1061D Driver-Plus Board PWM variable frequency output
180-240V 3-phase input
AC motor
feedback (non-isolated)
PWM generator
feedback processing
keyboard
Figure 2. The IRPT1061C control system
within a motor
page 1
IRPT1061A
System Description The IRPT1061A Power Module
The IRPT1061A power module, shown in figure 1, is a chip and wire epoxy encapsulated module. It houses input rectifiers, brake IGBT and freewheeling diode, output inverter, current sense shunts and NTC thermistor. The 3-phase input bridge rectifiers are rated at 800V. The inverter section uses 600V, short circuit rated, ultrafast IGBTs and ultrafast freewheeling diodes. Current sensing is achieved through 75 m low inductance shunts provided in the positive and negative DC bus rail. The NTC thermistor provides temperature sensing capability. The lead spacing on the power module meets UL840 pollution level 3 requirements. The power circuit and layout within the module are carefully designed to minimize inductance in the power path, to reduce noise during inverter operation and to improve the inverter efficiency. The Driver-Plus Board required to run the inverter can be soldered to the power module pins, thus minimizing assembly and alignment. The power module is designed to be mounted to a heat sink with two screw mount positions, in order to insure good thermal contact between the module substrate and the heat sink.
and Design Kit
The IRPT1061A (Figure 3) provides the complete power conversion function for a 1 hp (0.75 kW) variable voltage, variable frequency AC motor controller. The combines the Power Module (IRPT1061A) with a Driver-Plus Board (IRPT1061D). The Design Kit, IRPT1061E includes the following: * Complete integrated power stage * Specification and operating instructions * Bill of materials * Electrical schematic * Mechanical layout for Driver-Plus Board * Software transferrable file for easy design integration * Application information and layout considerations
Figure 3. IRPT1061C
page 2
IRPT1061A
Specifications
PARAMETERS Input Power
Voltage Frequency Current IFSM
VALUES
220V, -15%, +10%, 3-phase 50/60 Hz 6.2A rms @ nominal output 150A 0 - 230V rms 1 hp (0.75 kW) nominal full load power 150% overload for 1 minute 4.4A rms nominal full load power 6.6A rms 150% overload for 1 minute 425V maximum 7.9A 50kOhms 5% 3.1kOhms 10% 75mOhms 5% 10 s 20A peak
CONDITIONS
TA = 40C, RthSA = 1.24C/W 10 ms half-cycle, non-repetitive surge defined by external PWM control Vin = 220V AC, fpwm = 4 kHz, fo = 60 Hz, TA = 40C, RthSA = 1.24C/W
Output Power
Voltage Nominal motor hp (kW) Nominal motor current
DC Link
DC link voltage
Brake
Current
Sensor
Temp. sense resistance Current sense @ TNTC = 25C @ TNTC = 100C @ TSHUNT = 25C DC bus = 425V, VGE = 15V, line to line short
Protection
IGBT short circuit time Recommended short circuitshutdown current
Gate Drive
QG 34 nC (typical) VGE = 15V, refer figure 5b
Recommended gate driver
IR2132J (refer figure 10)
2500V rms -25C to 125C 1 Nm -40C to 125C 260C maximum
refer to design kit IRPT1061E
pin to baseplate, 60 Hz, 1 minute 95% RH max. (non-condensing) M4 screw type at the pins (.06" from case)
Module
Isolation voltage Operating case temperature Mounting torque Storage temperature range Soldering temperature for 10 sec.
page 3
IRPT1061A
RthSA 100% load (continuous) 10-60 Hz
Thermal Resistance(RthSAC/W)
Power 150%
RthSA 150% load (1 min.)10-60 Hz Power 100% RthSA 150% load (1 min.) down to 3 Hz
PWM Frequency (kHz) - (Induction Motor Load) Figure 4a. 1 hp/4.4A Output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency
Thermal Resistance(RthSAC/W)
RthSA 150% load (1 min.)10-60 Hz
Power 150% RthSA 150% load (1 min.) down to 3 Hz Power 100%
PWM Frequency (kHz) - (Induction Motor Load) Figure 4b. 0.75 hp/3.5A Output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency
NOTE: For Figures 4a and 4b: Operating Conditions: Vin = 230 Vrms, MI = 1.15, PF = 0.8, TA = 40C, ZthSA limits T c rise during 1 minute overload to 10C
page 4
Total Power Dissipation (Watt)
RthSA 100% load (continuous) 10-60 Hz
Total Power Dissipation (Watt)
IRPT1061A
Figure 5a. Typical Capacitance vs Collector-to-Emitter Voltage
Figure 5b. Typical Gate Charge vs Gate-to-Emitter Voltage
Figure 5c. Typical Transfer Characteristics
Figure 6. Nominal R-T Characteristics of the NTC Thermistor
page 5
IRPT1061A
Mounting Procedure
Mounting
1. Connect the driver board and the IRPT1061A power module. 2. Remove all particles and grit from the heat sink and power substrate. 3. Spread a .004" to .005" layer of silicone grease on the heat sink, covering the entire area that the power substrate will occupy. Recommended heat sink flatners is .001 inch/inch and Total Indicator Readout (TIR) of .003 inch below substrate. 4. Place the power substrate onto the heat sink with the mounting holes aligned and press it firmly into the silicone grease. 5. Place the 2 M4 mounting screws through the PCB and power module and into the heat sink and tighten the screws to 1 Nm torque.
Functional Information
Heat Sink Requirements
Figure 4 shows the thermal resistance of the heat sink required for various output power levels and Pulse-Width-Modulated (PWM) switching frequencies. Maximum total losses of the unit are also shown. This data is based on the following key operating conditions: * The maximum continuous combined losses of the rectifier and inverter occur at full pulse-width-modulation. These maximum losses set the maximum continuous operating temperature of the heat sink. * The maximum combined losses of the rectifier and inverter at full pulse-width-modulation under overload set the incremental temperature rise of the heat sink during overload. * The minimum output frequency at which full load current is to be delivered sets the peak IGBT junction temperature. * At low output frequency, IGBT junction temperature tends to follow the instantaneous fluctuations of the output current. Thus, peak junction temperature rise increases as output frequency decreases.
Figure 7. Power Module Mounting Screw Sequence
Power Connections
The power module pin designation, function and other details can be obtained from the package outline in Figure 8 and circuit diagram in Figure 9. Three phase input connections made to pins R, S and T and inverter output connections are made to pins U, V and W. Positive rectifier output and positive inverter bus are brought out to pins RP and P respectively in order to provide DC bus capacitor soft charging implementation option. The current shunt terminals are connected to pins IS1, IS2 and IS3, IS4 on the positive and negative DC rails respectively.
page 6
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1
2
Over Temperature Protection
Over temperature can be detected using the NTC thermistor included in the power module for thermal sensing. Protection circuit that initiates a shutdown if the temperature of the IMS substrate exceeds a set level can be implemented. The nominal resistance vs. temperature characteristic of the thermistor is given in Figure 6.
Voltage Rise During Braking
The motor will feed energy back to the DC link during regenerative braking, forcing the DC bus voltage to rise above the level defined by the input line voltage. Deceleration of the motor must be controlled by appropriate PWM control to keep the DC bus voltage within the rated maximum value.
IRPT1061A
NOTE: Dimensions are in inches (millimeters)
3.854 [97.89] 3.215 [81.66] 31X
HATCHED SURFACE .032 [0.81] .020 [0.51] THICKNESS
RT1 RT2 N/C G3 E3 G5 E5
F
.650 [16.51]
R
N
2.105 [53.47] 1.662 [42.21]
RP P IS1 IS2
G1 E1
2.040 [51.82]
BR
G7 IS4 IS3 G2 E2
G4 E4 G6 E6 N/C
U
S
T
V
W
.307 [7.80] .507 [12.87] HATCHED SURFACE E
Figure 8a. Power Module Package Outline
page 7
IRPT1061A
NOTE: Dimensions are in inches (millimeters)
ALL PIN COORDINATE DIMENSIONS ARE BASIC 3.420 [86.87]
1.550 [39.37]
1.250 [31.75]
1.350 [34.29]
1.450 [36.83]
2X O .104 .002 [2.64 0.05] MINUS DRAFT X .400 O .010 G S A B-C
1.550 [39.37]
.450 [11.43]
.750 [19.05]
.650 [16.51]
.550 [13.97]
.450 [11.43]
.350 [ 8.89]
.050 [ 1.27]
.850 [21.59]
.050 [ 1.27]
.350 [ 8.89]
1.020 [25.91] PIN CENTER
2X C .800 [20.32] .400 [10.16]
.187 [4.75] .175 [4.45]
B
.000 [ 0.00]
2X R .250 [6.35] 4X O .260 [6.60] PIN CENTER 1.020 [25.91] PIN DIAGONAL .037 - .034 [.940 - .864] 31X O .019 O .010 31X ( .026 - .024) 31X .050 [1.27] M M E-F E-F G B-C
1.050 [26.67]
1.750 [44.45]
1.450 [36.83]
1.150 [29.21]
1.250 [31.75]
.550 [13.97]
.950 [24.13]
.250 [ 6.35]
.150 [ 3.81]
.000 [ 0.00]
.250 [ 6.35]
.950 [24.13]
HATCHED SURFACE
F
E
HATCHED SURFACE
MOUNTING SURFACE IN CLAMPED CONDITION
A
Figure 8b. Power Module Package Outline
page 8
IRPT1061A
RP
P
IS1
IS2 E1 G1
E3 G3
E5 G5
RT1
RT2
RS1 D7 D9 D11 D13
Q1
D1
Q3
D3
Q5
D5 RT
R S T
Q7
U V W Q2 D2 Q4 D4 Q6 D6
D8
D10
D12
RS2
N
BR G7
IS4
1S3 G2 E2
G4 E4
G6 E6
Figure 9. Power Module Circuit Diagram
page 9
IRPT1061A
Figure 10. Recommended Gate Drive Circuit
page 10
IRPT1061A
Part Number Identification and Ordering Instructions
IRPT1061A Power Module
Chip and wire epoxy encapsulated module with 800V rectifiers, 600V short-circuit rated, ultra-fast IGBT inverter with ultra-fast freewheeling diodes, temperature sensing NTC thermistor and current-sensing low-inductance shunts.
IRPT1061D Driver-Plus Board
Printed circuit board assembled with DC link capacitors, NTC in-rush limiting thermistors, high-power terminal blocks, surge suppression MOVs, IGBT gate drivers, protection circuitry and low power supply. The PCB is functionally tested with standard power module to meet all system specifications.
IRPT1061C
Integrated Power Module (IRPT1061A) and Driver-Plus Board (IRPT1061D) pre-assembled and tested to meet all system specifications.
IRPT1061E Design Kit
Complete (IRPT1061C) with full set of design documentation including schematic diagram, bill of material, mechanical layout of Driver-Plus Board, schematic files, Gerber files and design tips.
page 11
IRPT1061A
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: 171 (K&H Bldg.), 3-30-4 Nishi-ikebukuro 3-Chome, Toshima-ku, Tokyo Japan Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 10/97
page 12

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